Outline
  
Day One
Fundamentals
 • Electrical signals • Maxwell vs. Kirchhoff: limits of circuit theory • Decibel and logarithmic scales • Spectrum of a signal: time domain vs. frequency domain • Resonance • Quality factor (Q) both loaded and unloaded • 
Bandwidth • 
Impedance matching definition • Frequency vs. dimensions (size) • Time vs. distance • Scattering parameters (s-parameters) • Typical formats and how to measure them
High speed/frequency effects in electronic circuits: when a capacitor is an inductor
 • High speed and RF effects: attenuation, gain, loss and distortion • Skin effect, return current and parasitic effects • The importance of rise time and fall times (dv/dt and di/dt) • Controlling signal return currents, differential vs. common mode currents • Introduction • Non ideal components • The "hidden schematic" concept
			- Resistors, capacitors and inductors
			- Ferrites
			- Transformers
			- Diodes
			- Transistors
			- ICs • Digital and high speed circuit key parameters
			- power, speed and package • Wires • 
Cables and connections basics • PCB structures (dielectric materials, structures, dissipation factor, the multi-layer structure idea) • 
Transmission lines basics • Lumped vs. distributed systems • 
Vias (effects and modelling in high frequency) • Shielding basics • Clocks
Transmission lines: controlling propagation
 • Wiring and connecting components
			- limitations for high frequency and high speed systems • 
What is a transmission line? • Motivation: signal propagation • Modelling a transmission line
			- Characteristic impedance
			- Velocity of propagation • description of typical transmission lines
			- coax, pairs, microstrip and stripline • Reflection coefficient • Standing wave ratio (SWR, VSWR and ISWR) and Return loss • Intuitive explanation • Examples from real world
Matching: Avoiding reflections. Obtaining maximum power transfer
 • Maximum transfer of power and avoiding reflections • Matching with LC components • Matching networks: L, PI and T networks • Matching in narrow and broadband networks • Matching with transformers • Matching with transmission lines • Terminations to avoid SI/EMI problems: solutions and techniques • Using software to design a matching network • Examples from real world
Day Two
Signal Integrity Parameters
 • What is Signal Integrity (SI) in electronic circuits? • undesired effects • Propagation time and delay • Reflections and ringing • Inductive vs. capacitive coupling
			- crosstalk (near and far) • Delays • 
Jitter • Ground bounce • Power supply noise • High frequency, dv/dt and di/dt
Grounding: the most important subject
 • Signal ground vs. safety ground • Ground in high frequency/speed applications
			- low impedance path • Minimizing ground impedance • Common impedance • 
Ground strategies (single point, multipoint, and hybrid) • Ground loops
Filtering
 • Basic ideas • Filters for known impedances (no EMI applications) • Basic design techniques with examples • 
Filters for EMI/EMC • How filters work: reflection vs. dissipation • Insertion losses • Source and load influence • Parasitic and location effects • Filtering with ferrites • Saturation and undesired coupling effects • Decoupling and bypass fundamentals • Damping resonances and ringing • Three terminal and feed through components
Printed Circuit Boards (PCBs)
 • Basic ideas • Design strategy • Partitioning and critical zones • PCB structures
			- dielectric materials, structures, dissipation factor • 
Choosing the PCB structure: how many layers and distribution • Power planes design and distribution • Layout and routing (1, 2 and multilayer) techniques
			- traces
			- microstrip and stripline
			- corners
			- vias
			- controlling impedance for SI
			- transmission line effects and solutions • Ground planes • Splits or ground discontinuities in planes (slots) • Decoupling and bypass (how, where, resonances, etc): discrete capacitors vs. embedded techniques in high speed/RF designs • Crosstalk and guards • How ground plane layout affects crosstalk • Mixed signal PCBs (A/D designs) • Controlling clock waveform • Clock distribution • Clock shielding • Examples from real world
Day Three
Cables
 • Basic ideas for cable fundamentals • The control of return current • Types of cables (wires, twisted pairs, coax, shielded cables, ribbon cables, etc.) • 
Cable impedance • Shielded cables and cable grounding • 
Connectors • Parasitics in connectors for high speed signals • 
Avoiding crosstalk and reflections in cables (layout and terminations) • Avoiding common impedance in cables • Reducing emissions and pick-up in cables • Examples from real world
Measuring and Troubleshooting Techniques
 • 
Antenna basics • How to measure EMI and SI effects
			- tools, instruments and techniques • Scope and probe limitations • Review of some typical errors in measurement techniques • Measuring high frequency current in electronic circuits • Diagnostic and troubleshooting techniques and hints • Locating EMI sources with near field probes