Outline
  
Part One: Daily Session 1,2,3 – approximately 2.5 hours each day
Introduction to MMIC Design
 • Advantages and tradeoffs: true cost, performance, reliability, size • Unique mm-Wave applications: Satellite communications, automotive radar, 5G, 60 GHz communications, beamforming •  Choosing among device technologies: GaAs FET/pHEMT, GaAs HBT, InP, SiGe, GaN HEMT • 
RFIC/MMIC Design cycle
			- process selection, device characterization, circuit topology decision, design, taping-out, testing
Passive MMIC Elements
 • mm-Wave element modeling
			- capacitors, inductors, transformers, via holes • 
Transmission line modeling
			- microstrip, coplanar. • 
mm-Wave combiners and dividers
			- Wilkinson, Lange, Pi-wave • 
Baluns, coupled lines, couplers. • mm-Wave impedance matching
			- Ruthroff transformer, Trifilar structure, and Coupled transmission line transformer
Odd / Even-mode Instability Detection
 • Gain definitions: Gmax, MSG, Unilateral gain • Conjugate matching • 
Stability analysis
			- odd mode, even mode analysis, bias-induced instabilities.  Instability tests
Part Two: Daily Session 4,5,6 – approximately 2.5 hours each day
Active Devices
 • 
De-embedding, Characterization, modeling. • 
GaAs MESFET, pHEMT, HBT, SiGe, InP and GaN HEMT • Device parameters: ft, fmax, gm, RON, parasitics • Equivalent circuit—physical basis • Intrinsic equivalent circuit • Illustrative example: equivalent circuit extraction • Thermal resistance and lifetime estimation • Design example: choosing FET gate-pitch and bias for 10+ years lifetime
mm-Wave Amplifiers
 • Biasing network selection
Single stage design: lumped vs. distributed matching
 • 
Design example: 30 GHz 4W GaN feedback amplifier • Multi-stage design
Part Three: Daily Session 7,8,9 – approximately 2.5 hours each day
Sample Case Studies
 • Designing a 20 – 40 GHz 10 W GaN amplifier • 
Designing a 75 – 100 GHz 2W amplifier • 
Designing a 80 GHz SiGe amplifier • Designing a 45 GHz CMOS amplifier • Design a 28 GHz CMOS amplifier
Layout
 • Layout design rules • Process control and monitoring • Reverse engineering • Yield and sensitivity analysis
Testing and Packaging
 • Rapid testing: on-wafer, dc-screening • Package design • Package parasitics
			- cavity effects, stabilization • Thermal management
			- epoxy, eutectic