RF and High Speed PC Board Design Fundamentals

Course 042

San Jose, CA	Dec 08-Dec 10, 2010
Course 042-4319	Presented by Rick Fornes
Register by 11/1/2010 and pay $1395, otherwise pay $1495

Request an onsite quote for this course

Summary:

This three-day course enables practicing engineers and CAD technicians to develop design rules for RF and high-speed designs, choose an optimal design tool, and organize the design process to most efficiently execute the design that will insure circuit performance, and minimize costs and production time.

Learning Objectives:

Upon completing the course, the participant will be able to:

• Discuss fundamental RF and digital PCB design issues.
• Compare and contrast transmission lines types, characteristics, and situations in which they can be used.
• Describe, evaluate, and compare termination types, PCB materials and fabrication processes, and packaging types.
• Identify and compensate for sources of interference.
• Measure and fine-tune circuit performance.
• Identify and select tools for developing transmission line design rules.

Target Audience:

Anyone working with RF circuits or high-speed digital logic, including RF engineers, digital logic engineers, technicians, and PCB layout professionals will benefit from this course. A practical engineering background and basic mathematics are required to follow the course.

Outline:

Day One
Fundamentals of Digital and RF Circuits
• RF vs. high speed digital requirements • Signal integrity • Properties of high speed logic gates • Pulse rise/fall times • Propagation time • Spectra of digital signals • Capacitance, inductance, and resistance • Frequency, wavelength, and phase • Transmission energy • Reflected waves • Five basic design rules
Transmission Line Fundamentals
• EM wave behavior • Calculating impedance • Velocity of propagation • Microstrip lines: surface and buried • Striplines: centered and off-centered
Use of Transmission Lines
• Shortcomings of point-to-point wiring • Line impedance control • Transmission line systems • Multilayer impedance variances

Day Two
Terminations
• Reflective energy • Reflection coefficient calculation • Use of terminations to eliminate reflections • Termination types
PCB Materials and Fabrication Processes
• Dielectric materials, properties and constants • Prepreg materials • Dissipation factors • PCB fabrication process • Multi-layer construction

Day Three
Sources of Interference
• Crosstalk • Ground bounce • Stub effects • EMI • Power supply noise • Mutual inductance • Ground discontinuity • Ribbon cable • Mechanical properties of Vias • Modeling Vias • Special connectors for high speed and RF applications
Defining Design Rules
• When are rules needed? • What characteristics must be taken into account? • What tools are available to implement design rules?

Subject Areas Covered

High-Speed PC Board Layout and Design

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