Applied Design of RF/Wireless Products and Systems

Course 161

San Diego, CA	Feb 28-Mar 02, 2011
Course 161-4338	Presented by Chris Potter
Register by 1/24/2011 and pay $1395, otherwise pay $1495

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Summary:

This course teaches the practicalities of turning a prototype circuit into a design suitable for production. RF designs for cellular phones, wireless LANs, and other cordless products have a difficult journey from concept to mass production. Not only are specialist skills required to architect these systems, and to invent suitable circuit topologies, but also to solve the integration and manufacturability issues of a high volume product. This course focuses on digital modulation in a practical context.

Learning Objectives:

Upon completing the course, the participant will be able to:

· Describe the common digital modulation standards and the types of modulation format that they employ
· Explain the component-level and system-level measurements required to characterise digital modulation systems
· List the key features, strengths and weaknesses of common transceiver architectures
· Specify the key measurements for digital receivers and transmitters
· Identify the effects of PCB layout on system performance, and use best practices to minimise layout-related problems
· Understand integration risks and use verification methods to validate a digital modulation system.

Target Audience:

Engineers, technicians, and engineering managers working in cellular communications would benefit from this intermediate-level course. The audience will typically include the practicing RF engineer in research or development of RF or microwave circuits; systems engineers responsible for the architecture of RF communications systems; or engineering managers who oversee these groups.

Outline:

Day One

Digital Modulation Fundamentals
• System link block diagram : modulate, tx, channel, rx, demodulate • Why Digital? : Resistance to fading, voice vs. packet data, capacity • IQ modulation representation : constellation, eye diagram display formats • BPSK, QPSK, MSK, properties of gaussian and RRC filtering, concept of ISI • Channel characteristics, diversity, fading types, mitigation techniques, Spread spectrum, OFDM, equalisation and training • TDMA, FDMA, CDMA definitions • TDD, FDD
Common Modulation Standards and Implications for RF Implementation
• Constant envelope modulation examples : Bluetooth, GSM • Non-constant Envelope Modulation examples : EDGE, W-CDMA, 802.11b (complementary code keying - spread spectrum), 802.11a (OFDM) • Constant-envelope tx, linear tx, limiting rx, linear rx • TDD - power ramping, • FDD - tx-rx isolation, mixing due to tx
RF Component-level Measurements
• Linear measurements : Power, S-Parameters (including Balanced devices), Group delay, Noise figure, Phase noise • Nonlinear measurements : Intermodulation, Load-pull, EVM, ACP, AM-AM and AM-PM calculated from IQ measurements • Two-tone Intermodulation • ACP • GSM and W-CDMA measurement examples • Modulation Accuracy - EVM • Rms, peak, 95th percentile • Measurement uncertainty properties of small EVMs • Load-pull • Source and Load plane contours of gain, efficiency, ACP, EVM

Day Two

Transceiver System Considerations
• System Aspects of GSM : Modulation, Timeslots and Frames • Transceiver architectures (Using GSM as a case study) : Superhet, Zero IF, low IF, IQ mod, Digital IF, Up-mix. Upconversion loop • ZIF issues and techniques • Bluetooth • 802.11b
Receiver Measurements
• Analysis of Cascaded Blocks • BER : Bit errors, block errors, frame erasure, sync errors, Typical measurement system, including loopback mode • Sensitivity Definitions, e.g. 1E-3 BER point • Receiver Blocking Mechanisms • Selectivity Measurements • Spurious Response Measurements • Measurement techniques - analogue IF / IQ / RSSI level sweep with interferer
Transmitter Measurements
• Spurious Emissions : Tx noise in rx band, Harmonics and mixing products • Transient Behaviour : Power - time response, Frequency spectrum due to power burst, Frequency kick due to power ramping • ACP : Due to modulation, due to power switching transients • Modulation Accuracy - EVM • Code Domain Power and PCDE

Day Three

Fabrication Technologies
• PCB types • Etching tolerances, board layer construction, vias/drill sizes, thermal reliefs, implications on RF performance • TDR characterisation
RF System Integration
• choosing PCB layer structure • grounding strategy • coupling between components • floorplanning : which side of the board to place components to maximise isolation • shielding / screening, gaskets, effectiveness • mismatches when cascading filters and amplifiers, pulling and buffering • Tolerancing / Yield • Thermal and electrical derating for reliability
Integration of RF and Baseband
• processor clocks getting into receivers • system planning to avoid harmonics at specific frequencies • reference spurs on VCOs • "hot" supply lines and control lines, and their effect on the system
The Design Verification Process
• What to test and what to look for at each prototype iteration • Integration Do's and Don'ts • Minimising the number of Prototype Iterations required • Automated Design Verification Testing
Case Studies
• GSM (GMSK and EDGE) • W-CDMA • DECT • FSK • PWT products

Subject Areas Covered

Modulation Techniques
RF and Wireless Measurements
High-Speed PC Board Layout and Design
EM Shielding/EMC Engineering
RF Systems Integration/Transceiver Architecture

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