EMC/Shielding/Grounding Techniques for Chip & PCB Layout

Course 140

Summary:

This seminar discusses techniques for identifying the sources of unwanted coupling and radiation, and systematic approaches for their minimization.

Learning Objectives:

Upon completing the course, the participant will be able to:

• Define electromagnetic compatibility.
• Identify sources of coupling and radiation.
• Discuss and simulate the effectiveness of various shielding strategies.

Target Audience:

Product and package design engineers of all expertise levels will benefit from this course. A basic engineering background (BSEE or equivalent) is required.

Outline:

Day One

Electomagnetic Compatibility
• Definition of EMC • Ground definitions • Measuring Radiation : large scale (test box) and localized (probes)
Coupling and Radiation
• Differential and common mode connections • Coupling control techniques • Crosstalk between microstrip vs other lines • Radiation vs. loop area • Isolation techniques
Shielding
• Shielding effectiveness and wave impedance; shield materials • Effects of slots and holes in shield • Multiple small or fewer large holes? • Transfer impedance as the effectiveness parameter
Grounding
• Current distribution between shield and ground plane • Coupling through common ground inductance • Shared vias • Ground plane discontinuities and inductance effects • Choking off ground currents, filtering the power lines
Experimental/Numerical Techniques of Problem Solving
Case Studies

Subject Areas Covered

EM Shielding/EMC Engineering
High-Speed PC Board Layout and Design

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